- 【Booth No】 E74-26
- 【Prefecture】 Niigata
- 【Certification & License】
- Diffusion Bonding and microchannel for thermal solutions
Diffusion bonding which is a bonding technology that without meting metal.Using in-house developed diffusion bonding equipment and bonding process technology to support 3D hollow structures from development to mass production.
Universal design hydrogen station diffusion bonded microchannel heat exchanger. For Inter-cooler and Pre-cooler.
For Supper computer, data server, telecommunications systems.Not only Copper but using stainless steel material version is also available for anti-cor...
Ultra-thin heat pipe. Cooling application for PC and smartphones. Able to maintain the uniform temperature on the sheet.And the flexible design for th...
*The above information is open to visitors for requesting appointment to exhibitors before the show.
It is strictly prohibited to use/reprint without prior consent for other purposes such as sales, etc.