- 【Booth No】 5-70
- 【Prefecture】 Osaka
In Software Cradle's booth, we display panels that introduce the cases of heat dissipation, structure-fluid coupling analysis and more. Our engineer experts are welcome to explain our company and products.
Applicable to evaluation of rotational devices such as fans and pumps. Analyses of multiphase flow phenomena such as mixing, blending, spraying, solid...
Applicable of heat dissipation design of electronics and precision instruments and analysis involving moving objects such as vehicle, controlled equip...
*The above information is open to visitors for requesting appointment to exhibitors before the show.
It is strictly prohibited to use/reprint without prior consent for other purposes such as sales, etc.